Amalgam margin breakdown caused by creep fatigue rupture.

Abstract

This study was designed to determine whether the mechanical cyclic stressing that occurs during normal mastication contributes to margin breakdown of dental amalgam restorations. The method used appears to duplicate the mechanical stresses developed in vivo during mastication, as the result of tooth flexing. We evaluated one low-copper alloy--NTD--and three high-copper alloys--Dispersalloy, Phasealloy, and Tytin. We prepared simple amalgam restorations in a cavity centrally located in an aluminum beam. Each specimen received five periods of three-point cyclical loading (1.7 hertz, 4200 cycles at 37 degrees C). The margin area was subjected to SEM examination prior to and at the completion of each period of cycling. At the beginning of each period of cycling, beam deflection was set to establish a maximum theoretical stress of 1, 2, 4, 6, or 8 MPa. For all brands, cycling resulted in margin gap formation and surface wrinkling. Wrinkling in Dispersalloy occurred as a wide band of shallow wrinkles, whereas that in NTD occurred as a narrow band of deep wrinkles. At 21,000 cycles, very little void formation and fracturing had occurred in the Dispersalloy or NTD restorations. In contrast, the Phasealloy and Tytin restorations developed extensive fracturing even after 4200 cycles. Fracture surface analyses of Phasealloy and Tytin indicated that creep fatigue rupture was the fracture mechanism responsible for margin breakdown in these amalgam restorations, when subjected to cyclic compressive loading similar to that experienced during mastication.

• Authors: P T Williams, J R Cahoon
• Journal: Journal of dental research (J Dent Res) Vol. 68 Issue 7 Pg. 1188-93 (Jul 1989) ISSN: 0022-0345 [Print] United States
• PMID: 2632604 (Publication Type: Journal Article, Research Support, Non-U.S. Gov't)

Chemical References

• Copper
• Dental Amalgam

Topics

• Copper
• Dental Amalgam
• Dental Restoration, Permanent
• Dental Stress Analysis (methods)
• Mastication
• Materials Testing
• Microscopy, Electron, Scanning