Self-healing epoxy composite with heat-resistant healant.

Abstract

To provide self-healing epoxy composite with adequate heat resistance for high-performance application, we developed a novel microencapsulated epoxy/mercaptan healing agent. The key measure lies in usage of diglycidyl ether of bisphenol A (EPON 828) as the polymerizable component and 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30) as the catalyst. Because of the higher thermal stability of EPON 828 and lower volatility of DMP-30, the healing agent and the self-healing composite not only survive high-temperature curing and thermal exposure, but also offer satisfactory capability of autonomous properties restoration, as characterized by both fracture mechanics and fatigue tests. Especially when the operation temperature is not higher than 200 °C, the performance of the healing system is nearly independent of thermal history.

• Authors: Yan Chao Yuan, Xiao Ji Ye, Min Zhi Rong, Ming Qiu Zhang, Gui Cheng Yang, Jian Qing Zhao
• Journal: ACS applied materials & interfaces (ACS Appl Mater Interfaces) Vol. 3 Issue 11 Pg. 4487-95 (Nov 2011) ISSN: 1944-8252 [Electronic] United States
• PMID: 21991982 (Publication Type: Journal Article, Research Support, Non-U.S. Gov't)